TPS546C23RVFT AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

TPS546C23RVFT product

TPS546C23RVFT

Voltage Regulators - DC DC Switching Regulators

PMBussynchronous buck35 Aintegrated MOSFETsremote sensecurrent telemetrytwo-phase capable

TPS546C23RVFT is an integrated 35 A synchronous buck regulator for digitally managed low-voltage rails requiring PMBus telemetry, configurable protection, and optional two-phase current sharing.

Best for

  • High-current processor, FPGA, ASIC, or memory power rails
  • Server, storage, switch, router, and base-station power systems
  • Digitally monitored rails using PMBus voltage, current, and temperature telemetry

Avoid if

  • Applications requiring input voltage above 18 V
  • Split-rail AVIN and PVIN operation
  • Very low-complexity rails where PMBus and high-current layout capability are unnecessary

Check before use

  • Verify the 4.5 V to 18 V input range covers all operating and transient conditions.
  • Set VOUT_SCALE_LOOP to match the external feedback-divider ratio.
  • Validate compensation and load-transient response on the final PCB.
  • Ensure adequate copper area, vias, and exposed-pad soldering for thermal performance.

Key specifications

Input voltage
4.5 V to 18 V
Output voltage
0.35 V to 5.5 V
Output current
35 A
Switching frequency
200 kHz to 1 MHz
Digital interface
PMBus 1.3
Package
40-pin 5 mm × 7 mm LQFN-CLIP

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
-
MSL
Level 2, 260 °C, 1 year
ECCN
-
HTSUS
-

Application

High-current point-of-load powerServers and enterprise storageNetwork switches and routersTelecom and base-station equipment

CAD Models

Download ECAD models for TPS546C23RVFT: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
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PCB Footprint
Land pattern for PCB layout
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3D Model
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Where to Buy

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Alternative components

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Design and risk insights

Questions & answers

TPS546C23RVFT is a Texas Instruments PMBus 1.3 compliant 35 A synchronous step-down DC/DC converter. It integrates high-side and low-side NexFET MOSFETs in a 40-pin RVF LQFN-CLIP package with an exposed thermal pad.