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TSM-103-01-F-DV AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

TSM-103-01-F-DV product

TSM-103-01-F-DV

Rectangular Connectors

HeaderSurface Mount2.54mm Pitch

The TSM-103-01-F-DV is a 6-position, 2-row surface mount header from Samtec's TSM series, featuring a 2.54mm pitch and gold-plated phosphor bronze pins.

Best for

  • Board-to-board interconnects
  • Cable-to-board applications

Avoid if

  • Through-hole mounting is required
  • High-vibration environments without additional strain relief

Check before use

  • PCB footprint compatibility
  • Mating connector series

Key specifications

Positions
6
Pitch
2.54mm
Mounting
Surface Mount
Operating Temp
-55°C to +125°C

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
REACH Unaffected
MSL
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040

Application

General Interconnect

Datasheet

TSM-103-01-F-DV-Samtec-datasheet-116533474.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for TSM-103-01-F-DV: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
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Where to Buy

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Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 6-position, double-row surface mount male pin header with a 2.54mm (0.100") pitch, designed for board-to-board or cable-to-board interconnects.