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TSW-115-07-F-D AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

TSW-115-07-F-D product

TSW-115-07-F-D

Rectangular Connectors

HeaderThrough-Hole2.54mm Pitch

The Samtec TSW-115-07-F-D is a 30-position, 2.54mm pitch double-row through-hole male header designed for board-to-board or cable-to-board interconnects.

Best for

  • General purpose board-to-board connectivity
  • IDC cable mating

Avoid if

  • Reflow soldering is required (use HTSW series instead)
  • High-vibration environments without additional retention

Check before use

  • PCB hole diameter
  • Mating connector compatibility

Key specifications

Positions
30
Pitch
2.54 mm
Mounting
Through Hole
Plating
Gold

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
REACH Unaffected
MSL
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040

Application

General Interconnect

Datasheet

TSW-115-07-F-D-Samtec-datasheet-116539033.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for TSW-115-07-F-D: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Where to Buy

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Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a standard strip, through-hole male pin header with 30 positions arranged in two rows, featuring a 2.54mm (0.100") pitch.