W25Q64FWSSIQ Datasheet, Specs, Alternatives & ECAD | Winbond Electronics Corporation | PartGenie

AI summary

W25Q64FWSSIQ product

The W25Q64FWSSIQ is a 64M-bit Serial Flash memory IC from Winbond, designed for low-power, space-constrained applications.

Best for

Code shadowing to RAM
Execute-in-place (XIP) applications
Battery-powered devices

Avoid if

Your system requires 3.3V logic levels without level shifting
High-reliability applications requiring long-term active production support

Check before use

Current lifecycle status
Supply voltage compatibility

Key specifications

Memory Size: 64 Mbit
Interface: SPI/QPI
Voltage: 1.8V
Package: SOIC-8

Compliance & Environment

RoHS: Y
REACH: -
MSL: -
ECCN: EAR99
HTSUS: 8542320051.0

Application

Consumer ElectronicsIndustrial Control

Datasheet

63e7fc0b233de4abac31e12f83fde01f.pdf

800 KB

CAD Models

Download ECAD models for W25Q64FWSSIQ: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 64M-bit (8M-byte) Serial Flash memory device that supports standard SPI, Dual/Quad I/O SPI, and QPI interfaces, operating at 1.8V.