W66DP2RQQAGJ Datasheet, Specs, Alternatives & ECAD | WINBOND | PartGenie

AI summary

W66DP2RQQAGJ product

W66DP2RQQAGJ is an 8Gb dual-die LPDDR4/LPDDR4X SDRAM with a x32 interface and 200-ball TFBGA package.

Best for

x32 embedded memory interfaces
systems requiring LPDDR4 or LPDDR4X operation
space-constrained designs using TFBGA packaging

Avoid if

The controller does not support LPDDR4 command and data training
The design cannot provide the required 1.1V or 0.6V VDDQ rail

Check before use

Confirm the selected LPDDR4 or LPDDR4X operating mode
Confirm the TFBGA 200-ball footprint and package dimensions
Confirm initialization, refresh, latency, and training requirements

Key specifications

Density: 8 Gb
Interface: LPDDR4 / LPDDR4X
Data width: x32
Package: TFBGA 200 ball, 14.5 mm × 10.0 mm × 1.1 mm

Compliance & Environment

RoHS: -
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Embedded computingConsumer electronicsMobile and compact systems

Datasheet

4745c89b2c69d1c1a0d34df2a594148c_W66DP2RQQAGJ.pdf

800 KB

CAD Models

Download ECAD models for W66DP2RQQAGJ: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an 8Gb dual-die LPDDR4/LPDDR4X combo SDRAM with a x32 interface, two x16 channels, eight banks per channel, and a TFBGA 200-ball package.