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WAFER-100L-6P AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-100L-6P product

WAFER-100L-6P

Integrated Circuits (ICs)

1×61.00 mm pitchSMTverticalwire-to-boardRoHS

WAFER-100L-6P is a 6-position vertical SMT connector on a 1.00 mm pitch, intended for compact wire-to-board interconnects.

Best for

  • Compact 1.00 mm-pitch wire-to-board interconnects
  • Six-conductor board connections

Avoid if

  • Electrical current or voltage ratings must be verified from a complete specification
  • The mating connector is not confirmed

Check before use

  • Confirm mating connector series and keying
  • Validate PCB land pattern and hold-down pads
  • Verify electrical and environmental ratings

Key specifications

Positions
1 × 6
Contact pitch
1.00 mm ± 0.1 mm
Mounting
Surface mount
Orientation
Vertical
RoHS
RoHS compliant

Compliance & Environment

RoHS
RoHS compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Compact wire-to-board interconnects

Datasheet

pYYBAGNl8i-AU0izAAGr_HH9h2M941.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-100L-6P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

WAFER-100L-6P is an XUNPU 1×6-position surface-mount connector with a vertical orientation and 1.00 mm contact pitch.