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WAFER-GH125DZ AI Analysis:
Specs, Applications & Alternatives

AI summary

WAFER-GH125DZ product

WAFER-GH125DZ

Terminals - Wire to Board Connectors

Crimp Terminal1.25mm PitchWire-to-Board

The WAFER-GH125DZ is a phosphor bronze crimp terminal designed for 1.25mm pitch wire-to-board connector systems, supporting AWG 26-32 wire.

Best for

  • Wire-to-board signal connections
  • Compact electronic assemblies

Avoid if

  • High-current applications exceeding 1A
  • Environments requiring gold-plated contacts

Check before use

  • Crimp tool compatibility
  • Wire gauge suitability

Key specifications

Current Rating
1 A
Voltage Rating
50 V
Wire Gauge
AWG 26-32

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Electronics

Datasheet

3593d8f29dad0085b445229edfeed035_HANBO(汉博)&WAFER-GH125DZ.pdf

800 KB

Datasheet AI

CAD Models

EDA symbol, PCB footprint, and 3D model for this component. Supported tools include Altium, KiCad, Eagle, and more.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a crimp terminal contact used in 1.25mm pitch wire-to-board connector assemblies.