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WAFER-HA2.54-10PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-HA2.54-10PZZ-Y62 product

WAFER-HA2.54-10PZZ-Y62

Component

XUNPUHA2.5XHB1×10through-hole2.50 mm pitch3.0 ARoHS

WAFER-HA2.54-10PZZ-Y62 is a XUNPU 1×10 through-hole connector wafer in the HA2.5/XHB family, rated for 250 V AC/DC and 3.0 A.

Best for

  • General low-power wire-to-board connections
  • Through-hole connector assemblies

Avoid if

  • A verified 2.54 mm mating interface is mandatory without drawing confirmation
  • Application requirements exceed 3.0 A or 250 V AC/DC

Check before use

  • Mating-part compatibility
  • PCB footprint and pitch
  • Required compliance and lifecycle documentation

Key specifications

Positions
10 positions
Stated pitch
2.50 ±0.15 mm
Rated voltage
250 V DC/AC (rms)
Rated current
3.0 A
Operating temperature
-25 °C to 85 °C
Withstanding voltage
1000 V AC for 1 minute

Compliance & Environment

RoHS
RoHS Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General electronics interconnectsThrough-hole board assemblies

Datasheet

61b41d6bec9a2de97e0b9983e370204b_WAFER-HA2.54-10PZZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-HA2.54-10PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU HA2.5/XHB-family 1×10-position through-hole connector wafer. The supplied drawing specifies a PA66 UL94V-2 beige housing and tin-plated copper-alloy contacts.