WAFER-HA2.54-3PZZ-Y62 Datasheet, Specs, Alternatives & ECAD | XUNPU | PartGenie

AI summary

WAFER-HA2.54-3PZZ-Y62 product

WAFER-HA2.54-3PZZ-Y62 is a 3-position XHB-series through-hole connector wafer with 2.50 mm pitch, rated at 250 V AC/DC and 3.0 A.

Best for

3-position wire-to-board interconnects
Through-hole connector assemblies
Equipment within the stated 250 V and 3.0 A ratings

Avoid if

A verified detailed mechanical drawing is required before PCB release
Higher-temperature applications exceeding 85 °C

Check before use

Mating housing compatibility
PCB footprint and hole dimensions
Application voltage, current, creepage, and clearance

Key specifications

Positions: 3
Pitch: 2.50 mm ±0.15 mm
Rated voltage: 250 V DC/AC(rms)
Rated current: 3.0 A
Operating temperature: -25 °C to 85 °C
Contact resistance: ≤20 mΩ

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Wire-to-board connectionsGeneral electronic equipment

Datasheet

5cf2402df7456eeb68d652914ff24982_WAFER-HA2.54-3PZZ-Y62.pdf

800 KB

CAD Models

Download ECAD models for WAFER-HA2.54-3PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU XHB-series 1x3 connector wafer for through-hole PCB mounting. It has three contacts on a 2.50 mm nominal pitch.