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WAFER-HA2.54-4PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-HA2.54-4PZZ-Y62 product

WAFER-HA2.54-4PZZ-Y62

Component

4-position2.50 mm pitchthrough-holewire-to-board3.0 A250 V

WAFER-HA2.54-4PZZ-Y62 is a 4-position, 2.50 mm-pitch through-hole wafer connector in the XUNPU HA2.5/XHB family, rated for 250 V DC/AC RMS and 3.0 A.

Best for

  • Low-current wire-to-board connections
  • General through-hole PCB assemblies

Avoid if

  • A verified mating-part system is not available
  • The PCB footprint requires dimensions not confirmed by the family drawing

Check before use

  • Verify exact 4-position body dimensions
  • Confirm mating housing and terminal compatibility
  • Check PCB hole pattern and pin layout

Key specifications

Positions
4
Pitch
2.50 ± 0.15 mm
Rated voltage
250 V DC/AC RMS
Rated current
3.0 A
Operating temperature
-25°C to +85°C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board connectionsGeneral electronic equipment

Datasheet

5516ef7669252ea00566a564ed6ab0bc_WAFER-HA2.54-4PZZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-HA2.54-4PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU HA2.5/XHB-series 4-position wafer connector for through-hole PCB mounting. The supplied information describes a 2.50 mm-pitch wire-to-board connector.