WAFER-HA2.54-5PWZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-HA2.54-5PWZ-Y62 product

WAFER-HA2.54-5PWZ-Y62

Component

XHB1x52.50 mm pitchright-anglethrough-hole250 V3.0 ARoHS

WAFER-HA2.54-5PWZ-Y62 is a 5-position XHB-series right-angle through-hole connector/header on 2.50 mm pitch, rated 250 V and 3.0 A.

Best for

  • Low-pin-count wire-to-board connections
  • Through-hole board interconnects

Avoid if

  • The mating connector series has not been confirmed
  • A verified detailed footprint or full 5-position mechanical drawing is required

Check before use

  • Confirm mating housing and terminal compatibility
  • Check PCB footprint and right-angle orientation
  • Confirm the 250 V and 3.0 A ratings are suitable for the assembled connector system

Key specifications

Positions
5
Pitch
2.50 mm ±0.15 mm
Rated voltage
250 V DC/AC rms
Rated current
3.0 A
Mounting
Right-angle through-hole
Temperature range
-25°C to +85°C

Compliance & Environment

RoHS
RoHS compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board interconnectsGeneral electronic assemblies

CAD Models

Download ECAD models for WAFER-HA2.54-5PWZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU XHB-series 1x5 right-angle through-hole wafer/header with 2.50 mm contact pitch.