WAFER-HA2.54-7PZZ-Y62 Datasheet, Specs, Alternatives & ECAD | XUNPU | PartGenie

AI summary

WAFER-HA2.54-7PZZ-Y62 product

WAFER-HA2.54-7PZZ-Y62 is a 7-position XUNPU XHB through-hole wafer header with 2.50 mm pitch, rated for 250 V and 3.0 A.

Best for

Low-density through-hole wire-to-board connections
PCB assemblies requiring a 7-position 2.50 mm-pitch header

Avoid if

A surface-mount connector is required
Operating temperature exceeds +85 °C
A verified lifecycle status is mandatory

Check before use

Confirm mating connector compatibility
Verify the 7-position mechanical dimensions and PCB footprint
Review voltage, spacing, and environmental requirements in the end product

Key specifications

Positions: 7
Pitch: 2.50 mm
Rated voltage: 250 V AC/DC (rms)
Rated current: 3.0 A
Operating temperature: -25 °C to +85 °C

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Wire-to-board PCB interconnectsGeneral through-hole electronics

Datasheet

723292195c12fac6e2320be3c40c71e4_WAFER-HA2.54-7PZZ-Y62.pdf

800 KB

CAD Models

Download ECAD models for WAFER-HA2.54-7PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU XHB-series 1x7 vertical through-hole wire-to-board connector header. The supplied drawing specifies a 2.50 mm contact pitch.