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WAFER-HA2.54-9PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-HA2.54-9PZZ-Y62 product

WAFER-HA2.54-9PZZ-Y62

Component

XHB series1×92.50 mm pitchthrough-hole250 V3.0 ARoHS compliant

WAFER-HA2.54-9PZZ-Y62 is a 9-position XHB-series through-hole wafer connector with a specified 2.50 mm pitch, 250 V AC/DC RMS rating, and 3.0 A current rating.

Best for

  • Nine-position through-hole wire-to-board connections
  • General low-voltage equipment using an XHB-compatible connector system

Avoid if

  • A verified full 9-position outline or PCB footprint is required from this document alone
  • Operating conditions exceed the stated 250 V or 3.0 A ratings

Check before use

  • Verify mating connector compatibility
  • Verify the PCB footprint against the actual 9-position part
  • Confirm required compliance and lifecycle status with the supplier

Key specifications

Positions
9
Pitch
2.50 mm ±0.15 mm
Rated voltage
250 V DC/AC RMS
Rated current
3.0 A
Operating temperature
-25 °C to 85 °C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board connectionsGeneral electronic equipment

Datasheet

06019d46def0670d482a31a91edafbe4_WAFER-HA2.54-9PZZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-HA2.54-9PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU XHB-series 1×9 through-hole wafer connector. The drawing specifies a 2.50 mm ±0.15 mm contact pitch, PA66 UL94V-2 housing, and tin-plated copper-alloy contacts.