WAFER-HY2.0-10PZZ-Y62 Datasheet, Specs, Alternatives & ECAD | XUNPU | PartGenie

AI summary

WAFER-HY2.0-10PZZ-Y62 product

WAFER-HY2.0-10PZZ-Y62 is a 10-position HY2.0 through-hole wafer connector with 2.00 mm pitch, rated at 200 V AC/DC RMS and 2.0 A.

Best for

10-circuit board-to-wire interconnects
Through-hole PCB assemblies using 2.00 mm pitch connectors

Avoid if

A verified mating-part number is required but has not been confirmed
A complete dimensional definition for PCB land pattern validation is required

Check before use

Confirm the mating housing and terminal system
Validate the position-specific DIM A and DIM B dimensions
Check voltage, current, and safety spacing requirements in the end equipment

Key specifications

Positions: 10
Pitch: 2.00 ± 0.10 mm
Rated voltage: 200 V AC/DC RMS
Rated current: 2.0 A
Mounting: Through Hole

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Board-to-wire interconnectsGeneral electronic assemblies

Datasheet

8c1e800af1267c3b937b38747e29f8f7_WAFER-HY2.0-10PZZ-Y62.pdf

800 KB

CAD Models

Download ECAD models for WAFER-HY2.0-10PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU HY2.0 series, single-row 10-position wafer connector for through-hole PCB mounting. Its contact pitch is 2.00 ± 0.10 mm.