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WAFER-HY2.0-3PWZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-HY2.0-3PWZ-Y62 product

WAFER-HY2.0-3PWZ-Y62

Rectangular Connectors

XUNPUHY series2.00 mm pitch3 positionright anglethrough holeRoHS

WAFER-HY2.0-3PWZ-Y62 is a 3-position, 2.00 mm pitch right-angle through-hole header for low-current wire-to-board or PCB interconnects.

Best for

  • 2.00 mm pitch wire-to-board interconnects
  • Right-angle PCB connector layouts
  • Low-current connections up to 2.0 A

Avoid if

  • A verified mating connector is not identified
  • The application exceeds 2.0 A or 200 V rating
  • A different pitch or vertical mounting orientation is required

Check before use

  • Verify the family drawing applies to the 3-position version
  • Confirm mating connector compatibility
  • Validate pad layout and pin orientation

Key specifications

Positions
3
Pitch
2.00 mm
Rated voltage
200 V DC/AC RMS
Rated current
2.0 A
Operating temperature
-25°C to +85°C
Contact resistance
≤25 mΩ

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board interconnectsGeneral PCB connectionsLow-current power connections

Datasheet

28701b3fd46aa30abe172c33d6758ff2_WAFER-HY2.0-3PWZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-HY2.0-3PWZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an XUNPU HY-series single-row, 3-position right-angle through-hole header with 2.00 mm contact pitch. The housing is beige PA66 rated UL94V-2, and the contacts are tin-plated copper alloy.