WAFER-HY2.0-4PZZ-Y62 Datasheet, Specs, Alternatives & ECAD | XUNPU | PartGenie

AI summary

WAFER-HY2.0-4PZZ-Y62 product

WAFER-HY2.0-4PZZ-Y62 is a 1x4, 2.00 mm-pitch through-hole HY series connector header rated for 2.0 A and 200 V AC/DC RMS.

Best for

2.00 mm pitch wire-to-board interconnects
General through-hole board connections

Avoid if

The application requires a confirmed lifecycle status
Exact mechanical dimensions have not been verified for the 4-position variant

Check before use

Confirm mating connector compatibility
Confirm the 4-position footprint dimensions
Check current derating in the end application

Key specifications

Positions: 1x4
Pitch: 2.00 mm ±0.10 mm
Current rating: 2.0 A
Voltage rating: 200 V AC/DC RMS
Operating temperature: -25 °C to +85 °C

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Wire-to-board connectionsGeneral electronics assemblies

Datasheet

d52b5c656c63b75e46f2ae2051d135ff_WAFER-HY2.0-4PZZ-Y62.pdf

800 KB

CAD Models

Download ECAD models for WAFER-HY2.0-4PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU HY series single-row, 4-position through-hole wafer connector/header with 2.00 mm pitch.