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WAFER-HY2.0-6PWZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-HY2.0-6PWZ-Y62 product

WAFER-HY2.0-6PWZ-Y62

Component

XUNPUHY series1x62.00 mm pitchright anglethrough hole200 V2.0 A

WAFER-HY2.0-6PWZ-Y62 is a 6-position, 2.00 mm pitch right-angle through-hole connector from XUNPU's HY series, rated at 200 V DC/AC rms and 2.0 A.

Best for

  • 2.00 mm pitch board-to-wire interconnects
  • Right-angle PCB connector layouts
  • General low-current electronic equipment

Avoid if

  • A different pitch or contact count is required
  • The mating connector family has not been verified
  • High-temperature conditions above 85 °C are expected

Check before use

  • Confirm mating-part compatibility
  • Confirm pad, drill, and keep-out dimensions from the drawing
  • Check required voltage and current derating for the final application

Key specifications

Positions
6
Pitch
2.00 mm
Rated voltage
200 V DC/AC rms
Rated current
2.0 A
Operating temperature
-25 °C to 85 °C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Board-to-wire interconnectsGeneral electronic equipment

Datasheet

7df78f913e4008f9883c32eae6245c0c_WAFER-HY2.0-6PWZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-HY2.0-6PWZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU HY series 1x6 connector with 2.00 mm pitch and right-angle through-hole terminals. The housing is beige PA66 rated UL94V-2, and the terminals are tin-plated copper alloy.