WAFER-HY2.0-6PZZ-W Datasheet, Specs, Alternatives & ECAD | Yuandi | PartGenie

AI summary

WAFER-HY2.0-6PZZ-W product

WAFER-HY2.0-6PZZ-W is a 6-position, 2.00 mm pitch through-hole HY-series board connector rated at 2.0 A and 250 V AC/DC.

Best for

2.00 mm pitch board-to-wire interconnects
Through-hole PCB assemblies

Avoid if

A surface-mount connector is required
The PCB thickness is outside 0.8 to 1.6 mm

Check before use

Confirm mating-part compatibility
Validate the 6-position footprint against the mechanical drawing
Confirm electrical derating in the end application

Key specifications

Positions: 6, single row
Pitch: 2.00 mm
Mounting: Through hole
Current rating: 2.0 A
Voltage rating: 250 V AC/DC

Compliance & Environment

RoHS: RoHS
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Board-to-wire connectionsGeneral PCB interconnect

Datasheet

ad7ffea2d7ca05fbbce303212da12889_WAFER-HY2.0-6PZZ-W.pdf

800 KB

CAD Models

Download ECAD models for WAFER-HY2.0-6PZZ-W: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a Yuandi HY-series single-row, 6-position through-hole board connector with a 2.00 mm contact pitch.