It is a XUNPU HY-series 1x7 through-hole connector with 2.00 mm nominal pin pitch. The housing is beige PA66 rated UL94V-2, and the contacts are tin-plated copper alloy.
WAFER-HY2.0-7PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD
AI summary
Key specifications
- Positions
- 7
- Pitch
- 2.00 mm ±0.10 mm
- Rated voltage
- 200 V AC/DC (RMS)
- Rated current
- 2.0 A
- Operating temperature
- -25 °C to +85 °C
Compliance & Environment
- RoHS
- Compliant
- REACH
- -
- MSL
- -
- ECCN
- -
- HTSUS
- -
Application
General PCB interconnectsConsumer equipment
Datasheet
CAD Models
Download ECAD models for WAFER-HY2.0-7PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.
EDA Symbol
Schematic symbol for your EDA tool
PCB Footprint
Land pattern for PCB layout
3D Model
STEP file for mechanical design
KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
Alternative components
Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.
