WAFER-HY2.0-7PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-HY2.0-7PZZ-Y62 product

WAFER-HY2.0-7PZZ-Y62

Component

HY series1x72.00 mm pitchThrough hole2.0 ARoHS compliant

WAFER-HY2.0-7PZZ-Y62 is a 7-position, 2.00 mm-pitch straight through-hole connector from XUNPU's HY series, rated for 2.0 A and 200 V AC/DC (RMS).

Best for

  • 2.00 mm pitch board-to-wire connections
  • Low-current through-hole PCB interconnects

Avoid if

  • The mating connector or exact seven-position dimensions are not confirmed
  • A connector with specified environmental or automotive qualification is required

Check before use

  • Confirm mating connector compatibility
  • Confirm 7-position mechanical dimensions and footprint
  • Check current derating for the assembled system

Key specifications

Positions
7
Pitch
2.00 mm ±0.10 mm
Rated voltage
200 V AC/DC (RMS)
Rated current
2.0 A
Operating temperature
-25 °C to +85 °C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General PCB interconnectsConsumer equipment

CAD Models

Download ECAD models for WAFER-HY2.0-7PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU HY-series 1x7 through-hole connector with 2.00 mm nominal pin pitch. The housing is beige PA66 rated UL94V-2, and the contacts are tin-plated copper alloy.