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WAFER-HY2.0-8PZZ-W AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-HY2.0-8PZZ-W product

WAFER-HY2.0-8PZZ-W

Component

8 position2.00 mm pitchthrough-holewire-to-boardwafer connector

An 8-position Zhongdi HY-series wafer connector with 2.00 mm pitch, vertical through-hole mounting, and a rated current of 2.0 A.

Best for

  • Compact wire-to-board PCB connections
  • Through-hole connector assemblies using 2.00 mm pitch

Avoid if

  • The design requires a different pitch, orientation, or mounting method
  • The application exceeds 2.0 A or 250 V DC/AC

Check before use

  • PCB layout and mating compatibility
  • Wire gauge and board thickness
  • Temperature and electrical limits

Key specifications

Positions
8
Pitch
2.00 mm
Mounting
Vertical through-hole
Current rating
2.0 A
Voltage rating
250 V DC/AC

Compliance & Environment

RoHS
RoHS compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

PCB wire-to-board interconnectsCompact electronic assemblies

Datasheet

C42451468.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-HY2.0-8PZZ-W: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an 8-position, 2.00 mm pitch, vertical through-hole wafer connector from Zhongdi's HY series.