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WAFER-HY2.0-8PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-HY2.0-8PZZ-Y62 product

WAFER-HY2.0-8PZZ-Y62

Component

HY series8 position2.00 mm pitchthrough hole2.0 ARoHS compliant

WAFER-HY2.0-8PZZ-Y62 is an 8-position, straight through-hole HY-series connector with 2.00 mm pitch, rated for 2.0 A and 200 V DC/AC RMS.

Best for

  • 2.00 mm pitch through-hole board interconnects
  • Eight-circuit connector interfaces

Avoid if

  • A verified mating connector or footprint is unavailable
  • Application conditions exceed 2.0 A or the stated temperature range

Check before use

  • Mating connector compatibility
  • PCB footprint and mounting orientation
  • Voltage, current, and temperature derating

Key specifications

Positions
8
Pitch
2.00 mm ±0.10 mm
Rated current
2.0 A
Rated voltage
200 V DC/AC RMS
Operating temperature
−25 °C to +85 °C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Board interconnectsGeneral electronics assemblies

Datasheet

f49ad85eaea7b17bc82cec4547ddfbf5_WAFER-HY2.0-8PZZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-HY2.0-8PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Login required · CAD models billed separately as an add-on

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU HY-series 1×8 straight through-hole connector with 2.00 mm nominal pitch. The housing is beige PA66 UL94V-2 and the contacts are tin-plated copper alloy.