WAFER-HY2.0-9PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-HY2.0-9PZZ-Y62 product

WAFER-HY2.0-9PZZ-Y62

Component

HY series9 position2.00 mm pitchthrough holewire-to-board

WAFER-HY2.0-9PZZ-Y62 is a 9-position, 2.00 mm-pitch through-hole HY-series connector wafer rated for 2.0 A and 200 V AC/DC RMS.

Best for

  • Compact 9-circuit wire-to-board connections using 2.00 mm pitch
  • General electronic assemblies within the stated current and voltage ratings

Avoid if

  • The mating housing or terminal system has not been confirmed
  • A verified lifecycle or qualification status is required

Check before use

  • Confirm the mating connector part number
  • Confirm the 9-position body width and PCB footprint
  • Check operating voltage, current, and insulation requirements in the complete assembly

Key specifications

Positions
9
Pitch
2.00 mm ±0.1 mm
Rated current
2.0 A
Rated voltage
200 V DC/AC RMS
Operating temperature
-25 °C to +85 °C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board connectionsGeneral electronic assemblies

CAD Models

Download ECAD models for WAFER-HY2.0-9PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU HY-series 1x9 through-hole connector wafer with 2.00 mm nominal contact pitch.