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WAFER-MX125CB-DZ AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-MX125CB-DZ product

WAFER-MX125CB-DZ

Component

HANBO1.25 mm pitchwire-to-boardultra-thin connectorAWG 28-32

WAFER-MX125CB-DZ is a HANBO 1.25 mm pitch ultra-thin connector component with 1 A and 125 V AC/DC contact ratings.

Best for

  • Compact low-current wire-to-board interconnects
  • 1.25 mm pitch connector systems

Avoid if

  • Exact pin count is not confirmed
  • A verified mating connector is unavailable

Check before use

  • Confirm circuit count
  • Confirm mating part number
  • Verify PCB footprint and mechanical clearance

Key specifications

Pitch
1.25 mm
Current rating
1 A AC/DC
Voltage rating
125 V AC/DC
Wire range
AWG 28 to AWG 32
Operating temperature
-25°C to +85°C

Compliance & Environment

RoHS
Compliant 2011/65/EU
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Compact wire-to-board connectionsLow-current electronic equipment

Datasheet

aa3a8745bf5ba4549f642ea783010cff_WAFER-MX125CB-DZ.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-MX125CB-DZ: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

WAFER-MX125CB-DZ is a HANBO ultra-thin wire-to-board connector series component with 1.25 mm contact pitch. The supplied datasheet includes connector and PCB-layout drawings.