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WAFER-PH2.0-3PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-PH2.0-3PZZ-Y62 product

WAFER-PH2.0-3PZZ-Y62

Rectangular Connectors

PH series1x32.00 mm pitchthrough holeconnector header2.0 A200 V

WAFER-PH2.0-3PZZ-Y62 is a 1x3, 2.00 mm-pitch through-hole PH connector header rated for 2.0 A and 200 V DC/AC RMS.

Best for

  • 2.00 mm-pitch through-hole wire-to-board interfaces
  • Low-power board interconnects within the stated 2.0 A and 200 V rating

Avoid if

  • Applications requiring verified REACH, MSL, or lifecycle documentation
  • Designs needing confirmed exact body dimensions before footprint release

Check before use

  • Verify the matching mating connector
  • Confirm the 1x3 mechanical outline and PCB footprint
  • Validate electrical derating for the end application

Key specifications

Positions
1x3
Pitch
2.00 mm ±0.15 mm
Rated current
2.0 A
Rated voltage
200 V DC/AC RMS
Operating temperature
-25°C to 85°C
Contact resistance
≤25 mΩ

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board interconnectGeneral PCB connections

Datasheet

0b4f140500b9159f06219f4bc817f57c_WAFER-PH2.0-3PZZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-PH2.0-3PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an XUNPU PH-series 1x3 through-hole wafer/header connector with a 2.00 mm pitch. Its housing is beige PA66 rated UL94V-2, and its terminals are tin-plated copper alloy.