WAFER-PH2.0-DZ AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-PH2.0-DZ product

WAFER-PH2.0-DZ

Terminals - Wire to Board Connectors

2.0mm PitchCrimp TerminalWire-to-Board

The WAFER-PH2.0-DZ is a 2.0mm pitch female crimp terminal by XUNPU, suitable for wire-to-board connections using AWG 30-24 wire.

Best for

  • Wire-to-board connections
  • Compact electronic assemblies

Avoid if

  • High-vibration environments without strain relief
  • Applications requiring gold-plated contacts

Check before use

  • Crimp tool compatibility
  • Housing series matching

Key specifications

Pitch
2.0 mm
Wire Range
AWG 30-24
Material
Phosphor Bronze
Plating
Tin

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsIndustrial Control

CAD Models

Download ECAD models for WAFER-PH2.0-DZ: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 2.0mm pitch female crimp terminal designed for wire-to-board interconnects.