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WAFER-PHB2.0-DZ-G AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-PHB2.0-DZ-G product

WAFER-PHB2.0-DZ-G

Interconnects

Crimp Terminal2.0mm PitchWire-to-Board

The WAFER-PHB2.0-DZ-G is a 2.0mm pitch crimp terminal for wire-to-board applications, supporting 250V/3A and AWG#24-28 wires.

Best for

  • Wire-to-board connections
  • Compact electronic assemblies

Avoid if

  • High-vibration environments without proper strain relief

Check before use

  • Crimp tool compatibility

Key specifications

Pitch
2.0 mm
Current Rating
3.0 A
Voltage Rating
250 V

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsIndustrial

Datasheet

e402feb5df4fe904acbd267da78f617c_2311081128_XUNPU-WAFER-PHB2-0-DZ-G_C19077245.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-PHB2.0-DZ-G: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Login required · CAD models billed separately as an add-on

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a crimp terminal designed for 2.0mm pitch wire-to-board connector systems.