WAFER-VH3.96-9PZZ-Y62 Datasheet, Specs, Alternatives & ECAD | XUNPU | PartGenie

AI summary

WAFER-VH3.96-9PZZ-Y62 product

WAFER-VH3.96-9PZZ-Y62 is a XUNPU 1x9 through-hole VH-style wafer connector with 3.96 mm pitch, a locking feature, 250 V DC/AC RMS rating, and 7.0 A current rating.

Best for

3.96 mm pitch wire-to-board connections
Through-hole PCB assemblies
Applications within 250 V and 7.0 A ratings

Avoid if

Surface-mount assembly is required
A verified lifecycle status is mandatory
The application exceeds 85°C ambient operating temperature

Check before use

Confirm mating connector compatibility
Confirm the 9-position footprint dimensions
Check electrical derating for the finished assembly

Key specifications

Positions: 9 positions
Pitch: 3.96 mm
Rated voltage: 250 V DC/AC RMS
Rated current: 7.0 A
Operating temperature: -25°C to 85°C

Compliance & Environment

RoHS: RoHS compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Wire-to-board connectionsGeneral electronic equipment

Datasheet

bcfb13073aeae8a2c291e7a0c41963ac_WAFER-VH3.96-9PZZ-Y62.pdf

800 KB

CAD Models

Download ECAD models for WAFER-VH3.96-9PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU VH 3.96 series 1x9-position through-hole wire-to-board wafer connector with a latch.