WAFER-XH2.54-2PZZ-Y62 Datasheet, Specs, Alternatives & ECAD | XUNPU | PartGenie

AI summary

WAFER-XH2.54-2PZZ-Y62 product

WAFER-XH2.54-2PZZ-Y62 is a 2-position XH-series through-hole wafer connector with 2.50 mm pitch, rated for 3.0 A and 250 V AC/DC (rms).

Best for

2-position board-to-wire connections
Low-voltage power or signal interconnects
Through-hole PCB assembly

Avoid if

A verified lifecycle status is required
The mating connector or exact body dimensions are not confirmed
Surface-mount assembly is required

Check before use

Verify mating plug and polarization
Confirm PCB drill pattern and mechanical clearance
Confirm current derating for the application environment

Key specifications

Positions: 2 positions, 1 row
Pitch: 2.50 ±0.10 mm
Mounting: Through Hole
Rated current: 3.0 A
Rated voltage: 250 V DC/AC (rms)
Temperature range: -25°C to +85°C

Compliance & Environment

RoHS: RoHS Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Board-to-wire interconnectLow-voltage power connectionGeneral electronics

Datasheet

196487fc9f6d461c7122e96193f37e78_WAFER-XH2.54-2PZZ-Y62.pdf

800 KB

CAD Models

Download ECAD models for WAFER-XH2.54-2PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU XH-series, single-row 2-position through-hole wafer/header connector. The datasheet specifies a 2.50 ±0.10 mm contact pitch.