WAFER-XH2.54-3PWZ-Y62 Datasheet, Specs, Alternatives & ECAD | XUNPU | PartGenie

AI summary

WAFER-XH2.54-3PWZ-Y62 product

WAFER-XH2.54-3PWZ-Y62 is a 3-position XH-series right-angle PCB header with 2.50 mm pitch, rated at 250 V AC/DC RMS and 3.0 A.

Best for

Three-circuit wire-to-board connections
Low-voltage PCB interconnects
Applications within the 3.0 A contact rating

Avoid if

A verified mating connector is not available
The design requires a confirmed lifecycle status
The PCB layout cannot be validated against the full mechanical drawing

Check before use

Confirm 2.50 mm pitch compatibility
Confirm the right-angle through-hole footprint
Validate voltage, current, and temperature margins

Key specifications

Positions: 3
Pitch: 2.50 mm ±0.15 mm
Rated voltage: 250 V DC/AC RMS
Rated current: 3.0 A
Operating temperature: -25 °C to 85 °C

Compliance & Environment

RoHS: RoHS Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Wire-to-board PCB connectionsConsumer electronic assembliesGeneral low-voltage interconnect

Datasheet

760b1817865edde7b12ca2b443d4af94_WAFER-XH2.54-3PWZ-Y62.pdf

800 KB

CAD Models

Download ECAD models for WAFER-XH2.54-3PWZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU XH-series 3-position right-angle through-hole connector header for PCB mounting. The datasheet drawing specifies a 2.50 mm pitch.