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WAFER-XH2.54-3PZZ-W AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-XH2.54-3PZZ-W product

WAFER-XH2.54-3PZZ-W

Component

XH series3 position2.50 mm pitchthrough-holewire-to-boardRoHS

WAFER-XH2.54-3PZZ-W is a 3-position vertical through-hole Zhongdi XH-series wafer connector with 2.50 mm pitch, rated for 3.0 A and 250 V AC/DC.

Best for

  • Low-voltage wire-to-board connections using an XH-compatible connector system
  • Vertical through-hole PCB connector layouts

Avoid if

  • A surface-mount connector is required
  • The mating housing or contact system has not been verified

Check before use

  • Verify mating connector compatibility
  • Check PCB hole and footprint dimensions against the drawing
  • Confirm current, voltage, and temperature margins for the assembled system

Key specifications

Positions
3
Pitch
2.50 mm
Current rating
3.0 A
Voltage rating
250 V AC/DC
Mounting
Straight through-hole

Compliance & Environment

RoHS
RoHS
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General wire-to-board interconnectsConsumer and general electronic assemblies

Datasheet

C42451427.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-XH2.54-3PZZ-W: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a Zhongdi XH-series 1x3P straight, through-hole wafer connector for wire-to-board interconnection. The datasheet drawing shows a 2.50 mm contact pitch.