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WAFER-XH2.54-3PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-XH2.54-3PZZ-Y62 product

WAFER-XH2.54-3PZZ-Y62

Component

XH series1x32.50 mm pitchthrough holewire to board

WAFER-XH2.54-3PZZ-Y62 is a 3-position XH-series through-hole wafer connector with 2.50 mm pitch, rated for 3.0 A and 250 V AC/DC RMS.

Best for

  • Three-wire wire-to-board interconnects
  • Through-hole XH-style connector assemblies

Avoid if

  • A confirmed 2.54 mm-pitch footprint is required
  • PCB dimensions must be derived from an unverified generic drawing

Check before use

  • Verify the mating housing and terminal system
  • Confirm the 3-position PCB land pattern
  • Confirm electrical derating for the application environment

Key specifications

Positions
3
Pitch
2.50 mm ±0.10 mm
Rated current
3.0 A
Rated voltage
250 V DC/AC RMS
Operating temperature
-25 °C to 85 °C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board interconnectsGeneral electronic equipment

Datasheet

1e77338b65839d2133153a5c3e5cd4b9_WAFER-XH2.54-3PZZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-XH2.54-3PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an XUNPU XH-series 1x3 wafer connector for through-hole PCB mounting. The supplied drawing specifies 2.50 mm pitch, a PA66 UL94V-2 beige housing, and tin-plated copper-alloy contacts.