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WAFER-XH2.54-4PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-XH2.54-4PZZ-Y62 product

WAFER-XH2.54-4PZZ-Y62

Rectangular Connectors

XH series1x42.50 mm pitchthrough holewire-to-board

WAFER-XH2.54-4PZZ-Y62 is a 1x4 XH-series through-hole wafer header with 2.50 mm pitch, rated for 250 V AC/DC RMS and 3.0 A.

Best for

  • 2.50 mm pitch wire-to-board PCB connections
  • Through-hole connector assemblies

Avoid if

  • A verified alternate pin count or exact body outline is required without additional mechanical confirmation

Check before use

  • Confirm mating connector series
  • Confirm 4-position PCB footprint
  • Review voltage spacing in the end product

Key specifications

Configuration
1x4 positions
Pitch
2.50 ±0.10 mm
Rated voltage
250 V DC/AC RMS
Rated current
3.0 A
Operating temperature
-25°C to +85°C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board interconnectsGeneral PCB assemblies

Datasheet

8aedb24ef5d039de8a15f95018a8219e_WAFER-XH2.54-4PZZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-XH2.54-4PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Login required · CAD models billed separately as an add-on

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU XH-series, single-row 4-position through-hole wafer/header for wire-to-board interconnection. The listed contact pitch is 2.50 ±0.10 mm.