WAFER-XH2.54-5PZZ-Y62 Datasheet, Specs, Alternatives & ECAD | XUNPU | PartGenie

AI summary

WAFER-XH2.54-5PZZ-Y62 product

WAFER-XH2.54-5PZZ-Y62 is a 5-position, 2.50 mm-pitch XH through-hole wafer connector rated for 3.0 A and 250 V DC/AC rms.

Best for

Five-wire board interconnects
General-purpose through-hole assemblies

Avoid if

A verified alternate pitch is required
A lifecycle-controlled or fully qualified connector is required without further manufacturer evidence

Check before use

Mating connector compatibility
PCB footprint and drill dimensions
Application derating and insulation spacing

Key specifications

Positions: 5
Pitch: 2.50 mm ±0.10 mm
Current rating: 3.0 A
Voltage rating: 250 V DC/AC rms
Operating temperature: -25°C to 85°C

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Wire-to-board interconnectsGeneral electronic equipment

Datasheet

f7dfe23d646955b83a57815b5ccce7c7_WAFER-XH2.54-5PZZ-Y62.pdf

800 KB

CAD Models

Download ECAD models for WAFER-XH2.54-5PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an XUNPU XH-series 1x5 wafer/header connector for through-hole PCB mounting. It has five tin-plated copper-alloy terminals on a 2.50 mm pitch.