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WAFER-XH2.54-6PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-XH2.54-6PZZ-Y62 product

WAFER-XH2.54-6PZZ-Y62

Component

XH series6 position2.50 mm pitchthrough holewire-to-boardRoHS compliant

WAFER-XH2.54-6PZZ-Y62 is a 6-position, through-hole XH-series connector header with 2.50 mm pitch, rated for 3.0 A and 250 V AC/DC.

Best for

  • Compact 6-wire PCB interconnects
  • XH-series wire-to-board connections
  • Through-hole assembly

Avoid if

  • A confirmed high-temperature connector is required
  • The mating housing or footprint has not been verified

Check before use

  • Mating connector part number
  • PCB footprint and drill dimensions
  • Complete mechanical envelope
  • Voltage-spacing requirements

Key specifications

Positions
6
Pitch
2.50 ± 0.10 mm
Current rating
3.0 A
Voltage rating
250 V AC/DC (rms)
Temperature range
-25°C to +85°C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board connectionsGeneral electronic equipment

Datasheet

8c6451d25fb24a47e0d382da59b28149_WAFER-XH2.54-6PZZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-XH2.54-6PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Login required · CAD models billed separately as an add-on

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU XH2.5-series, 6-position through-hole PCB connector header. It uses a 2.50 ± 0.10 mm contact pitch and tin-plated copper-alloy terminals.