WAFER-XH2.54-8PWZ-Y62 Datasheet, Specs, Alternatives & ECAD | XUNPU | PartGenie

AI summary

WAFER-XH2.54-8PWZ-Y62 product

WAFER-XH2.54-8PWZ-Y62 is an XUNPU XH-series 1x8 right-angle through-hole header with 2.50 mm pitch, rated for 250 V AC/DC RMS and 3.0 A.

Best for

2.50 mm pitch board-to-wire connector interfaces
Right-angle through-hole PCB connections

Avoid if

A verified complete mechanical envelope is required before footprint release
Surface-mount assembly is required

Check before use

Confirm mating XH-series connector compatibility
Verify 8-position PCB footprint dimensions
Check electrical loading against the 3.0 A rating

Key specifications

Positions: 8
Pitch: 2.50 mm
Mounting / Orientation: Through hole, right angle
Rated Voltage: 250 V AC/DC RMS
Rated Current: 3.0 A
Operating Temperature: -25 °C to +85 °C

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

General PCB interconnect

Datasheet

c5c6ef2832fec86aa7fe71f068ee5cd2_WAFER-XH2.54-8PWZ-Y62.pdf

800 KB

CAD Models

Download ECAD models for WAFER-XH2.54-8PWZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU XH-series 1x8 wafer-style PCB connector header. The part is a right-angle, through-hole version with 2.50 mm contact pitch.