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WAFER-XH2.54-8PZZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-XH2.54-8PZZ-Y62 product

WAFER-XH2.54-8PZZ-Y62

Rectangular Connectors

XH series8 position2.50 mm pitchthrough holewire-to-boardRoHS compliant

WAFER-XH2.54-8PZZ-Y62 is an 8-position XH-series through-hole header for 2.50 mm-pitch wire-to-board connections, rated for 250 V and 3.0 A.

Best for

  • 2.50 mm-pitch wire-to-board interfaces
  • General through-hole connector assemblies

Avoid if

  • A different mating connector family or pitch is required
  • A verified lifecycle or qualification status is mandatory

Check before use

  • Mating connector part and polarization
  • PCB footprint and pin spacing
  • Current derating in the final enclosure

Key specifications

Positions
8
Pitch
2.50 ±0.10 mm
Rated voltage
250 V DC/AC(rms)
Rated current
3.0 A
Operating temperature
-25°C to +85°C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board connectionsGeneral electronic equipment

Datasheet

90b71fcd4e4159d4b3d85231a5d78e3a_WAFER-XH2.54-8PZZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-XH2.54-8PZZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU XH-series 8-position through-hole wafer/header with a 2.50 mm pitch. The housing is beige PA66 UL94V-2 and the terminals are tin-plated copper alloy.