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WAFER-XH2.54-9PWZ-Y62 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-XH2.54-9PWZ-Y62 product

WAFER-XH2.54-9PWZ-Y62

Rectangular Connectors

XH series9 position2.50 mm pitchthrough hole3.0 ARoHS compliant

WAFER-XH2.54-9PWZ-Y62 is a 9-position XH-series through-hole header with 2.50 mm pitch, rated for 3.0 A and 250 V AC/DC.

Best for

  • Low-voltage wire-to-board interconnects
  • General electronic equipment using XH 2.50 mm pitch connectors

Avoid if

  • A verified high-temperature connector is required
  • The mating connector or PCB footprint is not confirmed

Check before use

  • Verify the mating XH-series housing and terminal system
  • Confirm board footprint and mechanical orientation
  • Confirm current derating for the final wiring and ambient temperature

Key specifications

Positions
9 positions
Pitch
2.50 mm
Rated current
3.0 A
Rated voltage
250 V DC/AC (rms)
Operating temperature
-25 °C to +85 °C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board connectionsGeneral electronic equipment

Datasheet

081a1d1bb60efb9e8a92ff7075e7cbe3_WAFER-XH2.54-9PWZ-Y62.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-XH2.54-9PWZ-Y62: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNPU XH2.5-series, 9-position wire-to-board connector header with 2.50 mm pitch. The housing is beige PA66 UL94V-2 and the contacts are tin-plated copper alloy.