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WAFER-XH254DZ AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WAFER-XH254DZ product

WAFER-XH254DZ

Interconnects

ConnectorCrimp Terminal2.54mm Pitch

The WAFER-XH254DZ is a standard 2.54mm pitch crimp terminal contact for XH-series wire-to-board connectors.

Best for

  • Wire-to-board connections
  • General electronics prototyping

Avoid if

  • High-vibration environments without strain relief
  • Applications requiring gold plating

Check before use

  • Crimp quality and wire retention force

Key specifications

Pitch
2.54 mm
Current Rating
3 A
Wire Gauge
AWG 22-28

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsIndustrial

Datasheet

e3a167e10a89120387a8d862687a0740_2404071514_Hanbo-Electronic-WAFER-XH254DZ_C22374524.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WAFER-XH254DZ: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a phosphor bronze, tin-plated crimp terminal contact designed for 2.54mm pitch XH-series connector housings.