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WB300A1E-043P-002 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WB300A1E-043P-002 product

WB300A1E-043P-002

Rectangular Connectors

MX3.03.00 mm pitch2×24 positionthrough holevertical headerRoHS

A 4-position, 3.00 mm-pitch dual-row vertical through-hole MX3.0 wire-to-board header rated for 600 V AC/DC and 5.0 A AC/DC.

Best for

  • Compact 3.00 mm-pitch wire-to-board connections
  • Through-hole PCB interconnects
  • General low-to-medium current electronic equipment

Avoid if

  • A different mating connector family or pitch is required
  • A surface-mount connector is required
  • Operating temperature exceeds -25 °C to +85 °C

Check before use

  • Mating plug and terminal compatibility
  • PCB footprint and retention-foot option
  • System-level current derating and insulation spacing

Key specifications

Positions
2 × 2, 4 positions
Pitch
3.00 mm
Rated voltage
600 V AC/DC
Rated current
5.0 A AC/DC
Temperature range
-25 °C to +85 °C

Compliance & Environment

RoHS
RoHS
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-board connectivityIndustrial electronicsGeneral electronic equipment

Datasheet

0301c44bd1ef21e083b177107a7c25e4_WB300A1E-043P-002.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WB300A1E-043P-002: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

WB300A1E-043P-002 is a ZGWD MX3.0 dual-row straight-pin wire-to-board PCB header with four positions arranged as 2×2. It is intended for through-hole mounting on a 3.00 mm-pitch PCB pattern.