It is a ZGWD MX3.0 dual-row, six-position, straight through-hole wire-to-board header with 3.00 mm contact pitch.
WB300A1E-063P-002 AI Analysis:
Datasheet, Specs, Alternatives & ECAD
AI summary
Key specifications
- Positions
- 6 (2×3)
- Pitch
- 3.00 mm
- Mounting
- Through-hole, straight
- Rated current
- 5.0 A AC/DC
- Rated voltage
- 600 V AC/DC
- Temperature range
- -25 °C to +85 °C
Compliance & Environment
- RoHS
- RoHS
- REACH
- -
- MSL
- -
- ECCN
- -
- HTSUS
- -
Application
Wire-to-board interconnectsIndustrial PCB assemblies
Datasheet
CAD Models
Download ECAD models for WB300A1E-063P-002: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.
EDA Symbol
Schematic symbol for your EDA tool
PCB Footprint
Land pattern for PCB layout
3D Model
STEP file for mechanical design
KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
Alternative components
Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.
