WB5557L-180C-0W is a ZGWD MX3.0-series double-row vertical wire-to-board connector with 18 positions arranged as 2x9. It uses 3.00 mm pitch through-hole terminals.
WB5557L-180C-0W AI Analysis:
Datasheet, Specs, Alternatives & ECAD
AI summary
Key specifications
- Contact configuration
- 18 positions, 2x9
- Pitch
- 3.00 mm
- Current rating
- 5.0 A AC/DC
- Voltage rating
- 250 V AC/DC
- Temperature range
- -25°C to 85°C
Compliance & Environment
- RoHS
- RoHS
- REACH
- -
- MSL
- -
- ECCN
- -
- HTSUS
- -
Application
Wire-to-board interconnectsIndustrial PCB wiringLow-voltage power distribution
Datasheet
CAD Models
Download ECAD models for WB5557L-180C-0W: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.
EDA Symbol
Schematic symbol for your EDA tool
PCB Footprint
Land pattern for PCB layout
3D Model
STEP file for mechanical design
KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
Alternative components
Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.
