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WF-1C125B AI Analysis:
Specs, Applications & Alternatives

AI summary

WF-1C125B product

WF-1C125B

Interconnects

1.25mm PitchCrimp TerminalWire-to-Board

The WF-1C125B is a 1.25mm pitch crimp terminal designed for wire-to-board connectivity, manufactured by BXCONN.

Best for

  • Compact wire-to-board connections
  • High-density PCB assemblies

Avoid if

  • Applications requiring high current capacity
  • Environments exceeding standard connector temperature ratings

Check before use

  • Crimp tool compatibility
  • Mating housing series

Key specifications

Pitch
1.25 mm
Wire Range
AWG #32-#28
Material
Phosphor Bronze

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsIndustrial Control

Datasheet

0b659db64ebf092dc690f8b39de04134_2406281358_BXCONN-WF-1C125B_C23398598.pdf

800 KB

Datasheet AI

CAD Models

EDA symbol, PCB footprint, and 3D model for this component. Supported tools include Altium, KiCad, Eagle, and more.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Login required · CAD models billed separately as an add-on

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a GH series 1.25mm pitch crimp terminal made of tin-plated phosphor bronze.