ProjectsPricingInsights

WF-1C200A AI Analysis:
Specs, Applications & Alternatives

AI summary

WF-1C200A product

WF-1C200A

Interconnects

Terminal2.0mm PitchCrimp

The WF-1C200A is a 2.0mm pitch crimp terminal by BXCONN, suitable for wire-to-board connections using AWG #30 to #24 wire.

Best for

  • Wire-to-board signal and power connections
  • Compact electronic assemblies

Avoid if

  • Applications requiring high-current capacity beyond AWG #24 limits

Check before use

  • Crimp tool compatibility
  • Mating housing series

Key specifications

Pitch
2.0 mm
Material
Phosphor Bronze
Plating
Tin

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Electronics

Datasheet

1a755287dead6acd4158fe13ee0e71ba_2406281358_BXCONN-WF-1C200A_C23398616.pdf

800 KB

Datasheet AI

CAD Models

EDA symbol, PCB footprint, and 3D model for this component. Supported tools include Altium, KiCad, Eagle, and more.

EDA Symbol
Schematic symbol for your EDA tool
Get Files
PCB Footprint
Land pattern for PCB layout
Get Files
3D Model
STEP file for mechanical design
Get Files

Login required · CAD models billed separately as an add-on

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

The WF-1C200A is a PH2.0mm series crimp terminal manufactured by BXCONN, designed for secure wire-to-board electrical connections.