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WF-1C200B AI Analysis:
Specs, Applications & Alternatives

AI summary

WF-1C200B product

WF-1C200B

Interconnects

2.0mm PitchCrimp TerminalWire-to-Board

The WF-1C200B is a 2.0mm pitch crimp terminal from BXCONN, suitable for wire-to-board connections using AWG #30 to #24 wire.

Best for

  • Wire-to-board interconnects

Avoid if

  • Applications requiring high-current capacity beyond AWG #24 limits

Check before use

  • Crimp tool compatibility

Key specifications

Pitch
2.0 mm
Wire Range
AWG #30-#24
Material
Phosphor Bronze

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Interconnect

Datasheet

23872f660d19e070904876329f9a46d6_2406281358_BXCONN-WF-1C200B_C23398626.pdf

800 KB

Datasheet AI

CAD Models

EDA symbol, PCB footprint, and 3D model for this component. Supported tools include Altium, KiCad, Eagle, and more.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 2.0mm pitch crimp terminal manufactured by BXCONN, typically used in wire-to-board connector assemblies.