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WF-1C254B AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WF-1C254B product

WF-1C254B

Interconnects

Crimp Terminal2.54mm PitchWire-to-Board

The WF-1C254B is a 2.54mm pitch crimp terminal by BXCONN, suitable for wire-to-board connections using AWG #30 to #22 wire.

Best for

  • Wire-to-board interconnects
  • General electronic assembly

Avoid if

  • Applications requiring high-current capacity beyond AWG #22 limits

Check before use

  • Crimp tool compatibility
  • Housing series matching

Key specifications

Pitch
2.54 mm
Wire Range
AWG #30 - #22
Material
Phosphor Bronze

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Interconnect

Datasheet

347e65e90d23d9fa0062867e4c4a7947_2406281358_BXCONN-WF-1C254B_C23398656.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WF-1C254B: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 2.54mm pitch crimp terminal manufactured by BXCONN, typically used in wire-to-board interconnect systems.