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WF-1D254B8P AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

WF-1D254B8P product

WF-1D254B8P

Interconnects

Header2.5mm PitchWire-to-Board

The BXCONN WF-1D254B8P is an 8-pin, 2.5mm pitch male header housing designed for wire-to-board applications, featuring a 3.0A/250V rating.

Best for

  • Wire-to-board connections
  • General industrial electronics

Avoid if

  • High-vibration environments without strain relief
  • Applications requiring high-temperature resistance above 85°C

Check before use

  • Mating connector compatibility
  • PCB footprint dimensions

Key specifications

Positions
8
Pitch
2.5 mm
Current Rating
3.0 A
Voltage Rating
250 V

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialGeneral

Datasheet

11d783e03eecc56812c42de4d7bcc1aa_2406281358_BXCONN-WF-1D254B8P_C23398643.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for WF-1D254B8P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Login required · CAD models billed separately as an add-on

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an 8-position male header housing with a 2.5mm pitch, manufactured by BXCONN for wire-to-board connectivity.