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X3025WR-06-9TSN AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

X3025WR-06-9TSN product

X3025WR-06-9TSN

Component

X3025 series1x63.0 mm pitchright anglethrough holewire-to-board

X3025WR-06-9TSN is a 6-position, 3.0 mm-pitch right-angle through-hole wafer for matching crimp housings, rated 5 A and 250 V AC/DC.

Best for

  • 3.0 mm-pitch wire-to-board connections
  • Right-angle through-hole PCB interconnects
  • Low-voltage power or signal harness interfaces within the stated ratings

Avoid if

  • A documented RoHS, REACH, MSL, or lifecycle status is mandatory
  • The design requires a connector system other than the X3025HM-compatible family
  • The application exceeds 5 A, 250 V AC/DC, or +105 °C

Check before use

  • Confirm mating housing and terminal selection
  • Verify PCB layout and mechanical keep-out
  • Apply system-level current, voltage, and temperature derating as required

Key specifications

Positions
6
Pitch
3.0 mm
Mounting
Right-angle through hole
Voltage rating
250 V AC/DC
Current rating
5 A AC/DC
Temperature range
-40 °C to +105 °C

Application

Wire-to-board interconnectsIndustrial control PCBsLow-voltage power distribution

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an XKB Connection 1x6 right-angle PCB wafer/header in the X3025 series. It has a 3.0 mm contact pitch, PA9T UL94V-0 housing, and brass pins with tin plating over nickel.