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X5621FV-2x04-C762D7430 AI Analysis:
Specs, Applications & Alternatives

AI summary

X5621FV-2x04-C762D7430 product

X5621FV-2x04-C762D7430

Component

DIP SocketIC SocketThrough-Hole

The X5621FV-2x04-C762D7430 is an 8-pin DIP IC socket from XKB Connection, featuring a 2.54mm pitch and 7.62mm row spacing.

Best for

  • Prototyping with DIP ICs
  • Socketing sensitive components

Avoid if

  • High-vibration environments without additional retention
  • Applications requiring non-standard row spacing

Check before use

  • Verify the physical dimensions of the IC to be socketed.

Key specifications

Positions
8
Pitch
2.54 mm
Row Spacing
7.62 mm
Current Rating
3 A

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

PrototypingIndustrial Control

Datasheet

ad59be7055d640df656be7d4ce186349_2110221630_XKB-Connection-X5621FV-2x04-C762D7430_C2908674.pdf

800 KB

Datasheet AI

CAD Models

EDA symbol, PCB footprint, and 3D model for this component. Supported tools include Altium, KiCad, Eagle, and more.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Login required · CAD models billed separately as an add-on

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an 8-position DIP (Dual In-line Package) IC socket with round hole contacts, designed for through-hole PCB mounting.