X5621FV-2x08-C762D7430 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

X5621FV-2x08-C762D7430 product

X5621FV-2x08-C762D7430

Component

DIP SocketIC SocketThrough Hole

The X5621FV-2x08-C762D7430 is a 16-pin DIP IC socket with a 2.54mm pitch and 7.62mm row spacing, designed for reliable through-hole mounting in industrial and general electronic applications.

Best for

  • Prototyping
  • Industrial control boards
  • General electronics

Avoid if

  • High-vibration environments requiring permanent soldering
  • Applications requiring non-standard row spacing

Check before use

  • PCB footprint compatibility
  • Insertion/extraction force requirements

Key specifications

Positions
16
Pitch
2.54 mm
Row Spacing
7.62 mm
Current Rating
3 A

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialGeneral Electronics

CAD Models

Download ECAD models for X5621FV-2x08-C762D7430: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 16-position DIP (Dual In-line Package) IC socket featuring round hole contacts, suitable for standard 2.54mm pitch components.