X5621FV-2x12-C762D7430 Datasheet, Specs, Alternatives & ECAD | XKB Connection | PartGenie

AI summary

X5621FV-2x12-C762D7430 product

The X5621FV-2x12-C762D7430 is a 24-pin DIP IC socket featuring a 2.54mm pitch and 7.62mm row spacing, designed for reliable through-hole mounting in industrial applications.

Best for

Prototyping DIP ICs
Industrial control boards

Avoid if

High-vibration environments without additional retention

Check before use

PCB footprint compatibility

Key specifications

Positions: 24
Pitch: 2.54 mm
Row Spacing: 7.62 mm
Current Rating: 3 A

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

IndustrialGeneral

Datasheet

bbfeaac00f216505eeedeb5bd76a29f6_2304140030_XKB-Connection-X5621FV-2x12-C762D7430_C2684756.pdf

800 KB

CAD Models

Download ECAD models for X5621FV-2x12-C762D7430: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 24-position DIP (Dual In-line Package) IC socket with round-hole contacts, suitable for 2.54mm pitch components.